Interface profile optimization for planar stress wave attenuation in bi-layered plates

摘要: Stress waves scatter upon entering a new medium. This occurs due to the reflection and transmission of waves, which depends on impedance mismatch between two materials angle incidence. For bi-layered structure with finite dimensions constant ratio, scattering intensity stress may be varied by changing interface profile layers. In this paper, methodology is proposed for optimizing layers plate objective planar wave attenuation. The plates are subjected at one end highly impulsive loadings various durations, geometry internal optimized purpose minimizing amplitude maximum reaction force opposite fixed end. optimization based genetic algorithm, coupled element method analyzing propagation behavior plates. It observed that amount attenuation depend duration applied loading, higher amounts obtained when wavelength associated load small compared