Low Temperature Hybrid Processing Technology of Fine Electronic Ceramics

摘要: Low temperature sintering is of vital importance for commercial production electronic ce‐ ramics, especially multi-layer devices [1, 2]. Due to superior mechanical strength, ferroelec‐ tric ceramics with fine-grained structures have attracted much attention and exhibited potential applications such as piezoelectric sensors actuators [3, 4-5]. Together, compo‐ site materials are also widely applied multilayer capacitors, transducers, packaging integrated circuits, high voltage insulators chemical [6-10]. It well known that materials’ performances closely related the ways they manufactured. Generally, ferroelectric fabrication process should achieve products dense homogeneous microstructure developed crystalline grains uni‐ form size in order ensure best physical properties. Using conventional ceramic proc‐ ess ideal microstructure, window required always narrow. Conversely, sol-gel derived lower. However, drawbacks sol–gel method aggregation ultrafine powders during formation secondary phases [11]. Thus, properties these deteriorated comparison those their counterparts. Recently, dense, crack-free thick film on silicon sub‐ strate has been subject considerable application micro-elec‐ tro-mechanical systems (MEMS). Combining micro-machined surfaces wafers films resulted novel micro-fluidic devices, micro-pumps, infrared sensors, dynamic random access memory, tunable microwave several others [12-16]. Most ca‐ pacitors (MLCC), require thickness be around 1 micrometer. In addition,