Intermetallic Phase Formation in Explosively Welded Al/Cu Bimetals
作者： H. Amani , M. Soltanieh
DOI: 10.1007/S11663-016-0682-1
关键词:
摘要: Diffusion couples of aluminum and copper were fabricated by explosive welding process. The interface evolution caused annealing at different temperatures time durations was investigated means optical microscopy, scanning electron microscopy equipped with energy dispersive spectroscopy, x-ray diffraction. Annealing in the temperature range 573 K to 773 (300 °C 500 °C) up 408 hours showed that four types intermetallic layers have been formed interface, namely Al2Cu, AlCu, Al3Cu4, Al4Cu9. Moreover, it observed iron trace formation Fe-bearing intermetallics Al, which is near Al-Cu layers. Finally, activation energies for growth AlCu + Al4Cu9, total layer calculated be about 83.3, 112.8, 121.6, 109.4 kJ/mol, respectively. Considering common methods (i.e., welding, cold rolling, friction welding), although there a great difference mechanism, found approximately same.
springer.com
harvard.edu
sci-hub.se 参考文章(30)
Yasuhiro Funamizu, Katsuya Watanabe, Interdiffusion in the Al–Cu System Materials Transactions Jim. ,vol. 12, pp. 147- 152 ,(1971) , 10.2320/MATERTRANS1960.12.147
L. Xu, Y.Y. Cui, Y.L. Hao, R. Yang, Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 435, pp. 638- 647 ,(2006) , 10.1016/J.MSEA.2006.07.077
Mostafa Mirjalili, Mansour Soltanieh, Kiyotaka Matsuura, Munekazu Ohno, On the kinetics of TiAl3 intermetallic layer formation in the titanium and aluminum diffusion couple Intermetallics. ,vol. 32, pp. 297- 302 ,(2013) , 10.1016/J.INTERMET.2012.08.017
H. T. G. Hentzell, R. D. Thompson, K. N. Tu, Interdiffusion in copper–aluminum thin film bilayers. I. Structure and kinetics of sequential compound formation Journal of Applied Physics. ,vol. 54, pp. 6923- 6928 ,(1983) , 10.1063/1.331999
Won-Bae Lee, Kuek-Saeng Bang, Seung-Boo Jung, Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing Journal of Alloys and Compounds. ,vol. 390, pp. 212- 219 ,(2005) , 10.1016/J.JALLCOM.2004.07.057
D. M. Rabkin, V. R. Ryabov, A. V. Lozovskaya, V. A. Dovzhenko, Preparation and properties of copper-aluminum intermetallic compounds Powder Metallurgy and Metal Ceramics. ,vol. 9, pp. 695- 700 ,(1970) , 10.1007/BF00803820
Farzad Foadian, Mansour Soltanieh, Mandana Adeli, Majid Etminanbakhsh, A Study on the Formation of Intermetallics During the Heat Treatment of Explosively Welded Al-Ti Multilayers Metallurgical and Materials Transactions A. ,vol. 45, pp. 1823- 1832 ,(2014) , 10.1007/S11661-013-2144-6
Characterization of intermetallic compounds in Cu–Al ball bonds: Mechanical properties, interface delamination and thermal conductivity Microelectronics Reliability. ,vol. 53, pp. 1068- 1075 ,(2013) , 10.1016/J.MICROREL.2013.02.020
S.A.A. Akbari Mousavi, P. Farhadi Sartangi, Effect of post-weld heat treatment on the interface microstructure of explosively welded titanium–stainless steel composite Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 494, pp. 329- 336 ,(2008) , 10.1016/J.MSEA.2008.04.032
Fanta Haidara, Marie-Christine Record, Benjamin Duployer, Dominique Mangelinck, Solid state reactions in Al–Cu–Fe thin film systems Intermetallics. ,vol. 21, pp. 62- 66 ,(2012) , 10.1016/J.INTERMET.2011.09.010