Method for producing resin paste, and resin paste
作者： Tomohiro Hirata , Katsuhiro Onose , 勝博 小野瀬 , 知広 平田
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摘要: PROBLEM TO BE SOLVED: To provide a method for producing resin paste, which improves the dispersibility of filler paste and simplifies production process. SOLUTION: This is characterized by compounding solution A comprising heat-resistant resin, solvent, titanate-based coupling agent with B heat- resistant solvent filler, paste. COPYRIGHT: (C)2001,JPO
lens.org 参考文章(6)
Masaaki Yasuda, Aizou Kaneda, Tsutomu Kitakatsu, Takashi Kousaka, Takafumi Dohdoh, Toshiaki Tanaka, Akira Kageyama, Paste composition, and protective film and semiconductor device both obtained with the same ,(1999)
Konotsune Shiro, Kikuta Kazutsune, Kawamoto Takao, Yano Hitoshi, COVER LAY INK RESIN COMPOSITION FOR COVERING CIRCUIT BOARD ,(1990)
Naito Shigeki, Takebe Kazuo, Nakamura Hiroshi, POLYIMIDE-BUTADIENE RESIN ,(1992)
Kimura Takeo, Watanabe Takeshi, Oomura Kaoru, PRODUCTION OF HEATTRESISTANT RESIN PASTE ,(1980)
Edowaado Nooman Piitaazu, NOVEL POLY (IMIDE-SILOXANE) BLOCK COPOLYMER AND ITS PRODUCTION ,(1988)
Dodo Takashi, Tanabe Yoshiyuki, Yamada Junji, PASTE COMPOSITION AND SEMICONDUCTOR DEVICE MADE BY USING THE SAME ,(1995)