作者: Jim Yin
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摘要: Computer apparatus 10 has a convective air flow therethrough for removing heat generated by the IC chips on circuit boards 12H, 12M, and 12L other computer components within housing 10H. The confines flow, elongated I/O openings 10E accommodating connections to boards. are mounted in an adjacent parallel relationship forming channels therebetween. Each board end 12P proximate interior 12D distant from housing. A mounting bracket 14 is fastened each at secured cover openings. Air vent apertures 16 brackets provide communication through directing portion of channel over Fan 10F pushes out causing cool outside be drawn into aperture 16.