Metal core substrate and process for manufacturing same

作者: Yukiji Watanabe , Masaru Yamazaki , Kazuhiko Ooi , Takaaki Yazawa

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摘要: A metal core substrate comprises a layer ( 10 ) consisting of first and second plates 11, 12 layered with third insulating 13 interposed therebetween; layers 20, 21 formed on the plates, respectively; wiring patterns 45, 46 layers, respectively. conductive 40 in through-hole 22 penetrates layer, plate, plate for electrically connecting pattern pattern. The 11 is connected 45 ), respectively, by means via 44 43 ). 42 41

参考文章(16)
Per Ligander, Leif Bergstedt, PCB and method for making PCB with thin copper layer ,(2001)
Lisa J. Jimarez, Miguel A. Jimarez, Mark V. Pierson, Surface metal balancing to reduce chip carrier flexing ,(2000)
Jerome Albert Frankeny, Richard Francis Frankeny, Janet Louise Rice, Terry Frederick Hayden, Ronald Lann Imken, Laminar stackable circuit board structure with capacitor ,(1998)
John M. Lauffer, Thomas R. Miller, William E. Wilson, Voya R. Markovich, Konstantinos I. Papathomas, Composite laminate circuit structure and methods of interconnecting the same ,(2002)
Takuji Okeyui, Shinya Ota, Megumu Nagasawa, Kei Nakamura, Masayuki Kaneto, Yasushi Inoue, Masakazu Sugimoto, Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board ,(2000)
Masakazu Sugimoto, Amane Mochizuki, Yasushi Inoue, Low thermal expansion circuit board and multilayer wiring circuit board ,(1999)
Peter A. Miller, UHF ground interconnects ,(2001)
Takuji Okeyui, Megumu Nagasawa, Kei Nakamura, Masakazu Sugimoto, Yasushi Inoue, Multi-layer wiring board and method for manufacturing the same ,(2000)