作者: Yukiji Watanabe , Masaru Yamazaki , Kazuhiko Ooi , Takaaki Yazawa
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摘要: A metal core substrate comprises a layer ( 10 ) consisting of first and second plates 11, 12 layered with third insulating 13 interposed therebetween; layers 20, 21 formed on the plates, respectively; wiring patterns 45, 46 layers, respectively. conductive 40 in through-hole 22 penetrates layer, plate, plate for electrically connecting pattern pattern. The 11 is connected 45 ), respectively, by means via 44 43 ). 42 41