Apparatus and method for mounting a chip
作者： Seiichi Sato , Kenichi Otake
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摘要: An apparatus and a method for mounting chip make it possible to accomplish quick also mount multiple different chips on substrates. Three heads are provided around center rod of head assembly; they horizontally rotate the rod. When horizontally, turned 180 degrees vertically by first bevel gear second gear. A nozzle one picks up flip from wafer sheet rotates transfer transferring head, during which inverts so as invert chip. The receives mounts substrate. According type be mounted, equipped with nozzles best suited chips.
google.com.tr参考文章(5)
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