作者: Masafumi Shimbo
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摘要: A method of manufacturing semiconductor device wherein the self-alignment technique is employed to simplify process and includes steps successively depositing multiple layer masking films comprising a first, second third on an n-type Si region, forming island region peripheral portion film which etched away, by side-etching, from edges other films, selectively oxidized film, etching first using as mask fine contact windows between formed thin lifting-off removing leaving contacts windows, oxidizing surface film.