Voids investigation in solder joints performed with vapour phase soldering (VPS)

摘要: Purpose – The main advantages of vapour phase soldering are a non-oxygen environment, the elimination overheating and possibility vacuum application, which can guarantee undeniably higher quality solder joints, especially as regards void formation. These features less affected by alloy composition. paper aims to discuss these issues. Design/methodology/approach joints made in two VPS options (with without vacuum) was investigated terms voids Solder alloys 37%Pb63%Sn (PbSn) 96%Sn3.5%Ag0.5%Cu (SAC 305) were applied an etched Cu layer on glass-epoxy substrate using screen-printing method. 1206 SMD resistors placed pads with Quadra pick-and place machine. For inspection joint structure identification, 3D X-ray images samples taken computed tomography system 180 kV/15 W nanofocus. comparison, traditional cross-sections performed me...