Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System
作者： Sun-Kyoung Seo , Moon Gi Cho , Hyuck Mo Lee
DOI: 10.1007/S11664-007-0256-8
关键词:
摘要: As a basis to understand the interfacial reaction between Sn-Bi solder and Ni substrate in electronic packaging, thermodynamic calculations of phase equilibria have been carried out on binary Ni-Bi system. The Gibbs free energy NiBi has approximated, using three-sublattice model, parameters evaluated, available experimental information boundaries other related properties. calculated diagram quantities system showed good agreement with data. Sn-Bi-Ni ternary was Sn-Bi, Sn-Ni, systems, it compared measurements.
springer.com
harvard.edu
sci-hub.se 参考文章(26)
Donna Sue Plickert, Nikki D. Wheaton, Kathleen Mills, Hugh Baker, Alloy phase diagrams ASM International. ,(1992)
Jou-I Lee, Sinn-Wen Chen, Hsiu-Yu Chang, Chih-Ming Chen, Reactive wetting between molten Sn-Bi and Ni substrate Journal of Electronic Materials. ,vol. 32, pp. 117- 122 ,(2003) , 10.1007/S11664-003-0181-4
V.I. Dybkov, O.V. Duchenko, Growth kinetics of compound layers at the nickel-bismuth interface Journal of Alloys and Compounds. ,vol. 234, pp. 295- 300 ,(1996) , 10.1016/0925-8388(95)02096-9
A.T. Dinsdale, SGTE data for pure elements Calphad-computer Coupling of Phase Diagrams and Thermochemistry. ,vol. 15, pp. 317- 425 ,(1991) , 10.1016/0364-5916(91)90030-N
Mulugeta Abtew, Guna Selvaduray, Lead-free Solders in Microelectronics Materials Science and Engineering: R: Reports. ,vol. 27, pp. 95- 141 ,(2000) , 10.1016/S0927-796X(00)00010-3
Otto Redlich, A. T. Kister, Algebraic Representation of Thermodynamic Properties and the Classification of Solutions Industrial & Engineering Chemistry. ,vol. 40, pp. 345- 348 ,(1948) , 10.1021/IE50458A036
Moon Gi Cho, Kyung Wook Paik, Hyuck Mo Lee, Seong Woon Booh, Tae-Gyu Kim, Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Journal of Electronic Materials. ,vol. 35, pp. 35- 40 ,(2006) , 10.1007/S11664-006-0181-2
G. Ghosh, Thermodynamic Modeling of the Nickel-Lead-Tin System. Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 30, pp. 1481- 1494 ,(1999) , 10.1007/S11661-999-0085-X
P. T. Vianco, J. A. Rejent, Properties of ternary Sn-Ag-Bi solder alloys: Part I-Thermal properties and microstructural analysis Journal of Electronic Materials. ,vol. 28, pp. 1127- 1137 ,(1999) , 10.1007/S11664-999-0250-4
Bo Sundman, Bo Jansson, Jan-Olof Andersson, The Thermo-Calc databank system Calphad. ,vol. 9, pp. 153- 190 ,(1985) , 10.1016/0364-5916(85)90021-5