Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture
作者： Cheng-Lien Chiang , Charles W. C. Lin
DOI:
关键词:
摘要: A three-dimensional stacked semiconductor package includes first and second chip assemblies. The assembly a chip, conductive trace encapsulant, the metal pillar. encapsulant aperture. pillar extends into
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