作者: Xiao Ma , Dongsheng Xu , Peiyu Ji , Chenggang Jin , James Lin
DOI: 10.1016/J.VACUUM.2019.03.004
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摘要: Abstract In this study, amorphous silicon carbide (α-SiC) films were synthesized on 316L stainless steel by low pressure, high density helicon wave plasma (HWP), using tetramethylsilane (TMS) as the single-source precursor which is organometallic compound. The influence of substrate bias voltage (Vs) surface morphology, structure, chemical composition, and mechanical properties α-SiC investigated. increase VS from 0 to 200 V causes removal organic moieties film results in formation condition for α-SiC. maximum deposition rate coating up 250 nm/s, related high-density (>1019 m−3) production HWP [1]. X-ray photoelectron spectroscopy (XPS) Fourier Transform Infrared Spectrometer (FTIR) imply that mainly composed SiC. deposited at VS = 200 V appear be high-hardness (up 33.6 GPa) materials with very small roughness (∼0.5 nm). Considering easy control voltage, our work provides a new method achieving high-yield room temperature.