Process for soldering smd components temporarily held by a solder lead evacuated by means of a vacuum connection

摘要: Abstract of EP0305697A process for soldering SMD components temporarily held by a solder head evacuated means vacuum connection. During or desoldering (13), the body these is covered (1), as result which, cooling, e.g. lateral blasting from outside, not very efficient. The invention provides to be on (1) device, which connected via line (15), and cooled after completion switching off at same time cooling gas into (15) hence component (13). For normal this lasts approximately 10 seconds prevents damaging re-heating