Semiconductor device manufacturing method and polishing apparatus
作者： Yukiteru Matsui , Hajime Eda
DOI:
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摘要: According to one embodiment, a semiconductor device manufacturing method is provided. In the method, process target film formed on substrate, and surface of polished by CMP method. The comprises heating rotating polishing pad from first temperature second higher than temperature, bringing into contact with heated temperature.
lens.org 参考文章(6)
David E. Slutz, Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing ,(2009)
Leland Swanson, Control of CMP removal rate uniformity by selective heating of pad area ,(2001)
Sujit Sharan, Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity ,(2000)
Thomas H. Osterheld, Stephen Jew, Jimin Zhang, Kun Xu, Use of pad conditioning in temperature controlled CMP ,(2008)
Thad Lee Brunelli, Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates ,(2003)
Shunichi Aiyoshizawa, Ryuichi Kosuge, Ryo Kato, Yu Ishii, Apparatus for heating or cooling a polishing surface of a polishing apparatus ,(2008)