作者: Sigurd R. Pettersen , Helge Kristiansen , Keith Redford , Susanne Helland , Erik Kalland
DOI: 10.1109/ECTC.2016.53
关键词:
摘要: Replacing the silver flakes in conventional isotropic conductive adhesives (ICAs) with micron sized polymer spheres coated tens to hundreds nanometer of (AgPS) drastically reduces content required obtain good electrical and thermal conductivity. In addition cost-benefits, this reduction amount precious metal can improve mechanical properties ICA by mitigation thermomechanical mismatch, as cores be customized material similar those adhesive matrix. It has previously been shown that thin films form metallic connections contact zones between particles during curing. This structure resistance filler is thus vital importance for relative low these ICAs. present work, mechanisms behind formation contacts were further investigated examining impact various curing conditions on conductivity, relating measurements cross-sectional SEM images. addition, conductivity ICAs storage at 85 °C % humidity. attributed grain growth improved conditions. Here, elucidated separating contributions from heat moisture, it was discovered massive large improvement only occurred samples stored elevated