Process for forming planarized, air-bridge interconnects on a semiconductor substrate

摘要: A process for fabricating a integrated circuit (IC), including plurality of devices coupled together by system metal interconnects disposed above semiconductor substrate comprises the steps forming conductive pedestals on surface substrate. portion form electrical contacts to devices, wherein height is higher than any feature After polyimide layer deposited thickness which covers pedestals, an etching step performed until top coplanar with layer. set interconnect lines then formed over and connections selected ones pedestal contacts.