Encapsulation using microcellular foamed materials

摘要: Injection molding encapsulation processes for packaging an object or objects in microcellular foamed material, comprising the steps of providing a mold having cavity, positioning at least one introducing fluid into material under conditions sufficient to produce supercritical fluid-packaging solution, solution and converting material. Such are advantageously employed electronic electrical components. Packaged produced therefrom may be completely partially encapsulated.