Cmp of copper/ruthenium/tantalum substrates
作者： Vlasta Brusic , Christopher C. Thompson , Paul M. Feeney , Renjie Zhou
DOI:
关键词:
摘要: The invention provides a chemical-mechanical polishing composition for substrate. comprises an abrasive, oxidizing agent, amphiphilic nonionic surfactant, calcium ion or magnesium ion, corrosion inhibitor copper, and water, wherein the pH of is 6 to 12. further method chemically-mechanically substrate with aforementioned composition.
lens.org 参考文章(26)
Jeffrey P. Chamberlain, Kevin J. Moeggenborg, Isaac K. Cherian, David W. Boldridge, Phillip W. Carter, Anionic abrasive particles treated with positively charged polyelectrolytes for CMP ,(2003)
Grigory Pyatigorsky, Manoocher Birang, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations ,(1996)
Brian Mravic, Anthony Mark Pasqualoni, Deepak Mahulikar, Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys ,(1998)
Isaac K. Cherian, Renjie Zhou, Steven K. Grumbine, Shumin Wang, Vlasta Brusic Kaufman, Method of polishing a multi-layer substrate ,(2003)
Paul Holzapfel, Warren Lin, Chris Karlsrud, James Schlueter, Methods and apparatus for detecting removal of thin film layers during planarization ,(1997)
Jeffrey P. Chamberlain, Joseph D. Hawkins, Homer Chou, Kevin J. Moeggenborg, CMP compositions for low-k dielectric materials ,(2002)
Jeffrey P. Chamberlain, Joseph D. Hawkins, David J. Schroeder, Kevin J. Moeggenborg, Phillip W. Carter, Homer Chou, Cmp method utilizing amphiphilic non-ionic surfactants ,(2003)
Manoocher Birang, William L. Guthrie, Allan Gleason, Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus ,(2003)
Katherine Lynn Saenger, Naftali Eliahu Lustig, Ho-Ming Tong, In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing ,(1993)