作者: Ali Ahmadinia , David Watson
DOI: 10.1007/978-1-4614-7705-1_2
关键词:
摘要: With the advances in electronic manufacturing technologies, integration of disparate technologies including sensors, analog components, mixed signal units and digital processing cores into a single chip has become reality, which is an increasing trend different application domains, especially for distributed smart camera products. In this chapter, survey existing System-on-Chip solutions cameras able to capture intelligently process video real-time communicate with other sensors remotely presented.