IC-Compatible Polysilicon Surface Micromachining
作者： J. J. Sniegowski , M. P. de Boer
DOI: 10.1146/ANNUREV.MATSCI.30.1.299
关键词:
摘要: ▪ Abstract Polysilicon surface micromachining is advancing significantly and many new applications are moving beyond the prototyping phase. Recent technical successes leading to excitement concerning various uses of devices in optical, wireless, sensor, other areas. Incorporation state-of-the-art integrated circuit (IC) fabrication methods, such as planarization by chemical mechanical polishing (CMP), has enabled extension a five-level technology. This opened significant design space, especially for microactuator applications. advancement situ microdiagnostics materials properties enhanced our understanding device reliability performance will allow operate near well-known limits. New IC-compatible further enhance capabilities microsystems terms performance, reliability, operation harsh environments.
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