PRODUCTION OF SOLDRED SEMICONDUCTOR WAFERS
作者： Ookubo Shizutaka , Nakajima Toshihiro
DOI:
关键词:
摘要: PURPOSE:To obtain soldered semiconductor wafers of a unifirom solder layer thickness by not applying metal plating to the side faces wafers.
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作者： Ookubo Shizutaka , Nakajima Toshihiro
DOI:
关键词:
摘要: PURPOSE:To obtain soldered semiconductor wafers of a unifirom solder layer thickness by not applying metal plating to the side faces wafers.