Detection of wire bonding failures

摘要: A device for monitoring a wire bonding process measures an electric signal applied to bond during the process, and generates output which discriminates between successful unsuccessful bonding. The employs at least one variable parameter. value of parameter is determined beforehand in learning by examples actual operations. Thus, detection method may adapt changing requirements automatically operate under optimal conditions large variety circuits be processed. preferably oscillating, measurement includes its peak or RMS amplitude.