Apparatus for depositing material into high aspect ratio holes

摘要: A sputter deposition system includes a hollow, cylindrical target 14 disposed between an end 12 and substrate 19, all of which are contained in vacuum chamber 20. plurality magnets 24 outside the to create intense, plasma regions 48 near interior surface thereby causing ionization sputtered neutrals. Rf power is inductively coupled into through rf coil 16 sustain 19 electrically biased control ion directionality energy.