Fan out type wafer level package structure and method of the same
作者： Wen-Kun Yang , Shih-Li Chen , Wen-Pin Yang
DOI:
关键词:
摘要: To pick and place standard dies on a new base for obtaining an appropriate wider distance between than the original of wafer. The package structure has larger size balls array die by fan out type package. Moreover, may be packaged with passive components or other side stacking structure.
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