Adhesion and interface investigation of polyimide on metals
作者： Y.-H. Kim , J. Kim , G.F. Walker , C. Feger , S.P. Kowalczyk
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摘要: The interface and adhesion of PMDA-ODA PAA-ethyl ester polyimides to several metals including Cr, Ni, Cu, Au have been studied by transmission electron microscopy (TEM) a 90° peel test. strength polyimide on is generally very high compared with that polyimide. trend in both cases the same, i.e., Cr has highest followed Au. Cross-sectional TEM studies showed fine particles were precipitated near case Cu (or Ni). precipitates not found closer than 80-200 nm from polyimide/Cu Ni) interface. Some large identified as Cu2O (NiO polyimide/Ni) scanning microdiffraction analyses. formation these was ascribed process involving first reaction polyamic acid form complex. During subsequent thermal curing, complex...
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