Effect of resin compositions on microwave processing and thermophysical properties of benzoxazine‐epoxy‐phenolic ternary systems filled with silicon carbide (SiC) whisker
作者： Chanchira Jubsilp , Tsutomu Takeichi , Salim Hiziroglu , Sarawut Rimdusit
DOI: 10.1002/PEN.21358
关键词:
摘要: Microwave processing of silicon carbide (SiC) whisker filled ternary systems based on benzoxazine, epoxy, and phenolic resins has been investigated using an industrial microwave apparatus at a fixed frequency 2.45 GHz. The low viscosity molding compound void-free cured specimens can easily be obtained from the resin mixtures. Increasing epoxy mass fraction in provided better coupling, therefore, faster curing time higher conversion under irradiation. However, greater amount mixture was observed to retard traditional thermal cure process as seen shifting exothermic peaks temperature. dielectric constant comparing with benzoxazine attributed phenomenon. Additionally, found render reduction linear expansion coefficient systems. development yields polymer high flexibility resin-curing agent mixing ratios relatively Tg broader range i.e., BEP451-BEP811. Synergism glass transition temperature is also maximum T g up 160°C BEP721.
sci-hub.se 参考文章(33)
D G Rogers, E Marand, D J T Hill, G A George, Anomalies between Microwave and Thermal Cure Kinetics of Epoxy-Amine Resin Systems High Performance Polymers. ,vol. 11, pp. 27- 39 ,(1999) , 10.1088/0954-0083/11/1/003
Sarawut Rimdusit, Hatsuo Ishida, Gelation study of high processability and high reliability ternary systems based on benzoxazine, epoxy, and phenolic resins for an application as electronic packaging materials Rheologica Acta. ,vol. 41, pp. 1- 9 ,(2002) , 10.1007/S003970200000
J.R. Lee, F.L. Jin, S.J. Park, J.M. Park, Study of new fluorine-containing epoxy resin for low dielectric constant Surface and Coatings Technology. ,vol. 180-181, pp. 650- 654 ,(2004) , 10.1016/J.SURFCOAT.2003.10.111
T Jeevananda, Siddaramaiah, Synthesis and characterization of polyaniline filled PU/PMMA interpenetrating polymer networks European Polymer Journal. ,vol. 39, pp. 569- 578 ,(2003) , 10.1016/S0014-3057(02)00272-0
S Rimdusit, H Ishida, Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins Polymer. ,vol. 41, pp. 7941- 7949 ,(2000) , 10.1016/S0032-3861(00)00164-6
Hatsuo Ishida, Douglas J. Allen, Mechanical characterization of copolymers based on benzoxazine and epoxy Polymer. ,vol. 37, pp. 4487- 4495 ,(1996) , 10.1016/0032-3861(96)00303-5
Chanchira Jubsilp, Tsutomu Takeichi, Salim Hiziroglu, Sarawut Rimdusit, High performance wood composites based on benzoxazine-epoxy alloys. Bioresource Technology. ,vol. 99, pp. 8880- 8886 ,(2008) , 10.1016/J.BIORTECH.2008.04.057
Tsutomu Takeichi, Yong Guo, Tarek Agag, Synthesis and characterization of poly(urethane‐benzoxazine) films as novel type of polyurethane/phenolic resin composites Journal of Polymer Science Part A. ,vol. 38, pp. 4165- 4176 ,(2000) , 10.1002/1099-0518(20001115)38:22<4165::AID-POLA170>3.0.CO;2-S
Thomas C-K Yang, Stanley H-Y Tsai, Sea-Fue Wang, Chung-Chih Juan, Dielectric and thermal studies of inorganic microfillers on polymer microwave substrates—metallocene cyclic olefin copolymers (COC) Composites Science and Technology. ,vol. 62, pp. 655- 661 ,(2002) , 10.1016/S0266-3538(02)00014-3
D. Sciti, L. Silvestroni, A. Balbo, S. Guicciardi, G. Pezzotti, High-Strength and -Toughness Electroconductive SiC-Based Composites† Advanced Engineering Materials. ,vol. 8, pp. 997- 1001 ,(2006) , 10.1002/ADEM.200600154