作者: Karl F. Tiefenbacher
DOI: 10.1016/B978-0-12-809438-9.00006-5
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摘要: This chapter provides technological information on the manufacturing of crisp sheet wafers—flat wafer sheets and hollow or shaped sheets. Then, using example sugar cookies from flat wafers, it discusses all steps required—from baking to packing final product. Flat wafer-based are main products worldwide. Special emphasis is technologies batter mixing, technical basics, mechanisms baking, details potential issues as well ways resolve them, quality assurance issues.