Transient liquid-phase bonding of alumina and metal matrix composite base materials

作者: Y ZHAI , T. H NORTH , J SERRATO-RODRIGUES

DOI: 10.1023/A:1018529228375

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摘要: Transient liquid-phase (TLP) bonding of aluminium-based metal matrix composite (MMC) and Al2O3 ceramic materials has been investigated, particularly the relationship between particle segregation, copper interlayer thickness, holding time joint shear strength properties. The long completion slow rate movement solid–liquid interface during MMC/Al2O3 markedly increased likelihood forming a particle-segregated layer at dissimilar interface. Preferential failure occurred through in joints produced using 20 30 μm thick foils times (≥20 min). When was very thin (<10 μm), determined by residual stress distribution Al2O3/MMC joints, not preferential fracture located bondline. Satisfactory properties were obtained when (5 thick) foil used TLP 853 K.

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