Solder alloy of electrode for joining electronic parts and soldering method
作者： Kenichiro Suetsugu , Atsushi Yamaguchi , Yoshinori Sakai
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摘要: A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent thermal fatigue resistant characteristic is presented. This a comprising Sn, Ag, Bi, Cu In as principal components, more particularly containing 81 to 91 wt. % 3.0 6.0 0.1 2.0 Cu. By adding small amount Ag the mainly composed formed, changes are decreased, so that an resistance obtained. Further, by Cu, intermetallic compound junction strength improved.
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