Apparatus and method for inspecting pcb-mounted integrated circuits
作者： Simon Butters , Hall David
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摘要: A method and apparatus for testing the mounting of an integrated circuit on a printed board using ball grid array comprises directing inclined laser beam from line scan sensor at circuit, detecting position lower edge light backscattered board, determining through trigonometric calculation height above following soldering comparing with reference data. The is deemed to have been successfully mounted if falls within predetermined range.
lens.org 参考文章(12)
David A. Noblett, Donald K. Rohrer, Robert L. Jackson, Donald J. Svetkoff, Method and system for triangulation-based, 3-D imaging utilizing an angled scanning beam of radiant energy ,(1996)
Scott E. Reinhart, Edward D. Huber, Rick A. Williams, Laser inspection tool system ,(1996)
Hiroyuki Ishigaki, Nobuyuki Umemura, Three-dimensional measuring device ,(2010)
Steven J. Gaspardo, Eugene L. DiMonte, Non-contact scanning system ,(2006)
P.A. Heimann, Measurement of the standoff height between a flip-mounted IC chip and its substrate IEEE Transactions on Components, Hybrids, and Manufacturing Technology. ,vol. 14, pp. 187- 191 ,(1991) , 10.1109/33.76530
Howard Stern, Mark Krichever, Murray Lawrence, James Drannbauer, Method and system for providing a high definition triangulation system ,(2007)
Thomas M. Ellington, Salvatore R. Coumo, Gap measurement tool ,(1978)
YouLing Lin, Ramakrishna Pattikonda, System and method for three-dimensional surface inspection ,(1999)
David Hall, Paul Rawlinson, Improvements in or relating to pcb-mounted integrated circuits ,(2010)
Zhongping Fang, Tong Liu, An inspection system ,(2004)