Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bath

摘要: There are provided a tin or tin-base alloy plating bath having significantly improved solderability, salt solution and an acid complexing agent for preparing controlling making up the bath, as well electrical electric components prepared by use of bath. The is one more metals selected from following group (I): copper, zinc, silver, indium, gold bismuth, which comprises, essential components, at least (A) to (D): 5 200 g/L divalent ions, (B) acids agents form water-soluble complex with total amount acid(s) agent(s) being stoichiometrically equivalent (C) elements Groups IB VB fourth sixth periods periodic table excluding tin, mercury, thallium included in (I), concentration metal(s) 20 2,000 ppm based on (D) 1 mg/L 10 antioxidants.