Integrated circuit package and method for fabrication

摘要: An integrated circuit package includes at least one semiconductor die embedded in a substrate made of heat deformable material such as plastic or combination plastics. The is so that the top surface die, which contains plurality bonding pads, exposed, and, certain embodiments, substantially coplanar with substrate. A layer conductive then formed on and surfaces(s) die. This into electrically paths each path beginning selected pad terminating an land Electrical connection between external circuitry by placing structure printed board, for example, balls lands adjacent electrical contacts board. If desired, protective coating can be over to protect