Hinged MEMS diaphragm

作者: Weili Cui , Ronald N. Miles

DOI:

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摘要: A micromechanical structure, comprising a substrate having through hole; residual portion of sacrificial oxide layer peripheral to the and polysilicon overlying hole, patterned have planar portion; supporting connecting on stiffeners formed extending beneath ribs surrounding portion, attached near periphery portion. The extend depth beyond stiffeners, laterally an edge are released from during manufacturing after region, reduce stress

参考文章(388)
Visvamohan Yegnashankaran, Gobi R. Padmanabhan, MEMS semiconductor sensor device ,(2007)
Bryan Patmon, Kathirgamasundaram Sooriakumar, Kok Ong, Kit-Wai Kok, Fabrication of silicon microphone ,(2004)
Zoltan A. Kemeny, Microbar and method of its making ,(2002)
Jozef Thomas Martinus Van Beek, Martijn Goossens, Willem Frederik Adrianus Besling, Peter Gerard Steeneken, Olaf Wunnicke, Mems capacitive pressure sensor ,(2013)
Chun Kai Mao, Chin Fu Kuo, Chin Hung Wang, Chao Ta Huang, Yu Wen Hsu, MEMS device with multiple electrodes and fabricating method thereof ,(2013)
Won-Taek Lee, Jung-Min Kim, Chang-Won Kim, Chung-Dam Song, Sung-Ho Park, Mems microphone package and packaging method ,(2010)
Davide Cattin, Design, Modelling and Control of IRST Capacitive MEMS Microphone University of Trento. ,(2009)