Achieving high-strength metallurgical bonding between A356 aluminum and copper through compound casting
作者： Lars Arnberg , Yanjun Li , Aina Opsal Bakke
DOI: 10.1016/J.MSEA.2021.140979
关键词:
摘要: Abstract Due to stable surface oxides on the solid copper and ease of forming Al2O3 films at aluminum melt surface, it is difficult achieve high-strength metallurgical bonding between two materials through compound casting. In this research, a novel coating method for inserts, namely hot-dip Sn-coating, has been applied. Through method, high-quality bond cast alloy A356 commercially pure was achieved gravity casting process. Tensile tests showed that maximum ultimate tensile strength (UTS) 90.8 MPa could be obtained bimetal interface. Microstructures formed in aluminum/copper interface were studied by optical- scanning electron microscopy, while sessile drop wetting test used study wettability Sn-coated substrates. The effects Sn-coating formation interfacial microstructure discussed.
sci-hub.st 参考文章(38)
Thaddeus B Massalski, Hiroaki Okamoto, PRnbsp Subramanian, Linda Kacprzak, William W Scott, None, Binary alloy phase diagrams ASM International. ,vol. 3, pp. 2874- ,(1986)
Gordon Hillis Aylward, Tristan John Victor Findlay, SI Chemical Data ,(1971)
M. Braunovic, N. Aleksandrov, Effect of electrical current on the morphology and kinetics of formation of intermetallic phases in bimetallic aluminum-copper joints holm conference on electrical contacts. pp. 261- 268 ,(1993) , 10.1109/HOLM.1993.489685
Won-Bae Lee, Kuek-Saeng Bang, Seung-Boo Jung, Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing Journal of Alloys and Compounds. ,vol. 390, pp. 212- 219 ,(2005) , 10.1016/J.JALLCOM.2004.07.057
Mohammad Sadegh Mohebbi, Abbas Akbarzadeh, Fabrication of copper/aluminum composite tubes by spin-bonding process: experiments and modeling The International Journal of Advanced Manufacturing Technology. ,vol. 54, pp. 1043- 1055 ,(2011) , 10.1007/S00170-010-3016-5
Jia-lei ZHAO, Jin-chuan JIE, Fei CHEN, Hang CHEN, Ting-ju LI, Zhi-qiang CAO, Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal Transactions of Nonferrous Metals Society of China. ,vol. 24, pp. 1659- 1665 ,(2014) , 10.1016/S1003-6326(14)63238-6
Ahmed O Al-Roubaiy, Saja M Nabat, Andre DL Batako, None, Experimental and theoretical analysis of friction stir welding of Al–Cu joints The International Journal of Advanced Manufacturing Technology. ,vol. 71, pp. 1631- 1642 ,(2014) , 10.1007/S00170-013-5563-Z
JF Li, PA Agyakwa, CM Johnson, None, Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process Acta Materialia. ,vol. 59, pp. 1198- 1211 ,(2011) , 10.1016/J.ACTAMAT.2010.10.053
N. Ahmed, Extrusion of copper clad aluminum wire Journal of Mechanical Working Technology. ,vol. 2, pp. 19- 32 ,(1978) , 10.1016/0378-3804(78)90012-8
Pavel Protsenko, Anne Terlain, Vladimir Traskine, Nicolas Eustathopoulos, The role of intermetallics in wetting in metallic systems Scripta Materialia. ,vol. 45, pp. 1439- 1445 ,(2001) , 10.1016/S1359-6462(01)01181-2