Image sensor package having a wall with a sealed cover

摘要: An image sensor chip is mounted on a printed wiring frame over substrate, which plated with spider web of conductors connecting the IC through via holes to bottom substrate as output terminals. After bonding conductor, package sealed. A wall erected around and covered transparent glass. lens may be placed in middle cover for focusing. The structure amenable mass production. large number frames are arranged matrix common substrate. sealed column by or all at once. sealing, diced into individual packages. integrated circuit chips peripheral circuits. glue opaque glue.