Methods for forming integrated circuits within substrates

摘要: The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the a method of an circuit substrate comprising: a) providing recess in substrate; b) printing antenna recess; c) chip battery electrical connection with antenna. another having first second formed therein; conductive film between recesses recesses, interconnects recesses; component d) e) covering component, at least protective cover. therein, bottom surface sidewall joined to surface; interconnect circuitry on surfaces; operatively connected circuitry.