Impurity diffusion in metals. Tin in copper and lead in silver
作者： S. K. Sen , M. B. Dutt , A. K. Barua
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摘要: The diffusion of tin in copper and lead silver has been studied by the resistometric method, using step annealing procedure Ceresara et al. impurity coefficient D2 activation energy Q2 are determined for systems under consideration. values thus obtained fairly good agreement with those earlier studies radioactive tracer X-ray techniques. data interpreted terms electrostatic theory metals.
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