Growth of the nano-phase intermetallic compounds and its effect on mechanical behavior of Au80Sn20/CrMnFeCoNi solder joints during isothermal aging
作者： Xiao Liu , Baishan Chen , Siyuan Wu , Yunzhu Ma , Siwei Tang
DOI: 10.1016/J.JALLCOM.2020.157823
关键词:
摘要: Abstract High entropy alloy (HEA) like CrMnFeCoNi is deemed to be the next generation of novel structure materials because its high strength and toughness. So it really worth probe joining behavior as a latent material. However, there are few studies on under actual service condition. In this paper, we investigated microstructure mechanical properties Au80Sn20/CrMnFeCoNi solder joint after aging. The results indicate that no new phase in time aging based XRD data. thickness intermetallic compound (IMC) layer aged for 360 h reaches 6.31 μm, 2.1 times larger than IMC without Moreover, nanoscale Co3Fe7 particles grow gradually with extended time, reaching 560 nm at growing nearly 1.5 times. But Vickers hardness shear decrease continuously extension time. manifest deterioration point joints, providing guiding significance industrial application.
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