Oxide wire bond insulation in semiconductor assemblies

摘要: A semiconductor integrated circuit package is provided with insulated bonding wires. The die mounted to a base of either leadframe or grid-array package. plurality wires are bonded between pads on the and fingers at inner ends conductors. have an oxygen-plasma oxide formed thereupon thereby provide electrically-insulated prevent short-circuits adjacent After wire wires, subjected oxygen plasma form insulating aluminum copper thereupon. An simultaneously removed from outer leads by blasting medium.