Roll-to-roll gravure printing of thick-film silver electrode micropatterns for flexible printed circuit board
作者： Kee-Hyun Shin , Ho Anh Duc Nguyen , Janghoon Park , Dongjun Shin , Dongjin Lee
DOI: 10.1007/S11998-016-9844-Y
关键词:
摘要: This paper presents a novel method for printing thick silver electrodes with high fidelity using rotogravure technique and high-viscosity ink. The widths thicknesses of the printed were investigated respect to angle speed. In addition, use low-surface-energy polyethylene terephthalate substrate was found decrease ink transfer angles up 60°, possibly because small adhesive force at interface between substrate. We therefore employed substrates higher surface energies, namely polyimide treated polyimide, enhance transfer. A lower speed 0.5 m/min viscosity 15 Pa·s are required obtain better functionality resistivity. However, proposed method, fidelities patterns achieved even speed of 10.5 m/min 15 Pa·s, necessitating subsequent sintering process. Therefore, pattern sintered in an oven 350°C 10 min. Patterned 1 m length, 121 ± 2.2 μm line width, 6.5 ± 2.2 μm average thickness, resultant resistivity 9 µΩ·cm achieved. findings this study confirm potential fabricating flexible circuit boards large areas.
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