作者: Bo-Jr Huang , Kuan-Yu Lin , Yi-Wei Chen , Chin-Chou Liu
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摘要: An interposer element in a multidimensional integrated circuit with stacked elements has one or more conductors, especially power supply lines, coupled through decoupling networks defining low impedance shunts for high frequency signals to ground. The successive tiers including silicon, metal and dielectric deposition layers. network conductor at least preferably two reactive transmission lines. A line an inductor series the parallel capacitances terminals. inductors are formed by traces spaced layers forming coil windings vias connecting between permit crossovers. MOScaps embodiment serially coils input, output junction coils, wherein magnetically form transformer.