The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints
作者： Guang Zeng , Stuart D. McDonald , Qinfen Gu , Yasuko Terada , Kentaro Uesugi
DOI: 10.1016/J.ACTAMAT.2014.10.003
关键词:
摘要: … added to the Sn–Cu system, besides exhibiting significant solubility in Sn (such as Bi and In), alloying elements have the potential to introduce new intermetallics in addition to Cu 6 Sn …
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