Correct modelling of geometry and materials properties in the thermo-mechanical finite-elements-simulation of chip scale packages
作者： E. Zukowski , E. Deier , J. Wilde
DOI: 10.1109/ESIME.2005.1502865
关键词:
摘要: The first part of the work reported here is dedicated to 3D finite-elements modelling CSP. It will take into account both thermal-mechanical characteristics assembly materials and geometric factors. Here an approach modular parametric with standardized modules linked via contact elements proposed. Also aspects CAD systems for parameterized are treated. concept also allow efficient calculations a variable number bumps. second paper descriptions, which necessary simulation CSP assemblies. Measured data as well suitable models numerical representations discussed. relevant thermo-mechanical properties package presented. Besides actual solder alloys polymers like moulding compounds In order calibrate check results, ESPI sensor was used measuring thermal deformations specimens under loads in comparison finite simulations. FE-models validated by experimental results present stress state cycling.
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