Construction of monolithic chip and method of distributing power therein for individual electronic devices constructed thereon

摘要: To eliminate parasitic voltage drops to electrodes of semiconductor devices built on a chip or wafer, due the use an element and current supply conductor in common for several such devices, separate path is diffused each electrode, onto wafer as built-up post basic material back surface used relatively wide area bus, which may also be connected metal base double purpose establishing that at some selected known potential providing good heat sink wafer. Generally, placed ground, but need not be.