Cellular Automata Simulation of Gap-Filler Dissolution during Transient Liquid Phase Bonding of Single Crystal Materials
作者： Adam Ghoneim , Olanrewaju Akanbi Ojo
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摘要: A new numerical model is developed using a Cellular Automata (CA) method to study the liquid-phase dissolution behavior of gap-filler powder particles in interlayer mixture during transient liquid phase (TLP) bonding process. The prediction microstructural evolution TLP joint between single crystal substrates show that formation misoriented stray-grains results from incomplete liquation particles. In contrast what generally assumed and reported, calculations coupled with experimental verification under properly selected process parameters, complete melting possible. This imperative prevent maintain crystallinity materials. dependence on salient parameters are analyzed discussed.
sci-hub.st 参考文章(28)
Y. Zhou, Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding Journal of Materials Science Letters. ,vol. 20, pp. 841- 844 ,(2001) , 10.1023/A:1010914813875
Y. Nakao, K. Nishimoto, K. Shinozaki, C. Y. Kang, Transient Liquid Insert Metal Diffusion Bonding of Nickel-Base Superalloys Springer Netherlands. pp. 129- 144 ,(1990) , 10.1007/978-94-009-0433-0_11
He Yang, Chuan Wu, HongWei Li, XiaoGuang Fan, Review on cellular automata simulations of microstructure evolution during metal forming process: Grain coarsening, recrystallization and phase transformation Science China Technological Sciences. ,vol. 54, pp. 2107- 2118 ,(2011) , 10.1007/S11431-011-4464-3
H. Yin, S.D. Felicelli, L. Wang, Simulation of a dendritic microstructure with the lattice Boltzmann and cellular automaton methods Acta Materialia. ,vol. 59, pp. 3124- 3136 ,(2011) , 10.1016/J.ACTAMAT.2011.01.052
Ch.-A. Gandin, M. Rappaz, A coupled finite element-cellular automaton model for the prediction of dendritic grain structures in solidification processes Acta Metallurgica Et Materialia. ,vol. 42, pp. 2233- 2246 ,(1994) , 10.1016/0956-7151(94)90302-6
K.G.F. Janssens, An introductory review of cellular automata modeling of moving grain boundaries in polycrystalline materials Mathematics and Computers in Simulation. ,vol. 80, pp. 1361- 1381 ,(2010) , 10.1016/J.MATCOM.2009.02.011
Ch. -A. Gandin, J. -L. Desbiolles, M. Rappaz, Ph. Thevoz, A three-dimensional cellular automation-finite element model for the prediction of solidification grain structures Metallurgical and Materials Transactions A. ,vol. 30, pp. 3153- 3165 ,(1999) , 10.1007/S11661-999-0226-2
W.D. Zhuang, T.W. Eagar, Liquid infiltrated powder interlayer bonding: a process for large gap joining Science and Technology of Welding and Joining. ,vol. 5, pp. 125- 134 ,(2000) , 10.1179/136217100101538128
R. Sasikumar, R. Sreenivasan, Two dimensional simulation of dendrite morphology Acta Metallurgica Et Materialia. ,vol. 42, pp. 2381- 2386 ,(1994) , 10.1016/0956-7151(94)90316-6
Stephen Wolfram, Universality and complexity in cellular automata Physica D: Nonlinear Phenomena. ,vol. 10, pp. 1- 35 ,(1984) , 10.1016/0167-2789(84)90245-8