On-chip “baluntennas” for differential-mode non-contact characterization of mmW/THz devices and ICs

摘要: We present a novel on-chip, lens-integrated differential-mode double-slot antenna structure to enable iso-lated, pure signal injection and interrogation for on-wafer devices integrated circuits. Testing of on-chip differential circuits conventionally requires Marchand-type baluns either with the device or dual-tip contact-probes. Nevertheless, these state-of-the-art balun-integrated probes can cover only up 110 GHz. In this work, we demonstrate 180°-hybrid “baluntenna” based on design that concurrently acts as high isolation balun. The baluntenna is device-under-test quasi-optical link used effectively couple test signals into out ports under test. As such, approach allows, first time, non-contact, characterization at well beyond 100