Method for building interconnect structures by injection molded solder and structures built

摘要: A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by sheet material having thickness greater than that to be formed, has sufficient optical transparency so as allow inspection subsequently filled into cavities are formed in material, and coefficient thermal expansion is substantially similar substrate which will mated to, multiplicity filling with cooling temperature solidify cavities, positioning intimately such facing structure, heating together sufficiently high transfers onto structure.