The Effect of Plating Current Densities on Self-Annealing Behaviors of Electroplated Copper Films
作者： Shih-Chieh Chang , Jia-Min Shieh , Bau-Tong Dai , Ming-Shiann Feng , Ying-Hao Li
DOI: 10.1149/1.1500348
关键词:
摘要: … annealing after electroplating. In this study, however, we found that the rate of self-annealing … We suggest that the microstructure transformation of Cu deposits was driven by two sources…
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