Semiconductor packaging with internal wiring bus
作者： Shiann-Ming Liou , Albert Wu , Chenglin Liu
DOI:
关键词:
摘要: A packaged semiconductor includes inner bond fingers, at least first and second dies, an interposer. The further wiring between the dies interposer dies. thereby reduces count of fingers needed for fingers. provides indirect access to when are inaccessible by
google.de 参考文章(111)
Larry R. Brown, Michael S. Healy, Wayne R. Gombotz, Very low temperature casting of controlled release microspheres ,(1990)
Abraham Jacob Domb, Lynda Mary Sanders, Delayed/sustained release of macromolecules ,(1987)
Anwar Hussain, Takeru Higuchi, Ocular therapeutic system manufactured from copolymer ,(1976)
Todd O. Bolken, Chad A. Cobbley, Method for fabricating semiconductor component having stacked, encapsulated dice ,(2003)
Thomas A. Russell, Flexible illuminators for phototherapy ,(2000)
Anup Bhalla, Yueh-Se Ho, Sik K. Lui, Leeshawn Luo, Mike Chang, Integrated circuit package for semiconductor devices with improved electric resistance and inductance ,(2002)
Gerald W. DeVries, Larry A. Wheeler, Methods and compositions for treatment of ocular neovascularization and neural injury ,(2001)
Felix Theeuwes, Atul D. Ayer, Osmotic system with distribution zone for dispensing beneficial agent ,(1978)
Stephen L. Clauss, Rainer K. Zawadzki, Michael J. Pastel, Stable porfimer sodium compositions and methods for their manufacture ,(1993)
Jerry Charles Bommer, Bruce Franklin Burnham, Tetrapyrrole therapeutic agents ,(1985)