Thermosettable pressure sensitive adhesive

摘要: The invention refers to a photopolymerizable precursor of pressure-sensitive thermosettable adhesive, said comprising: (i) from about 30% 80% by weight with respect the mass component, comprising monomeric or prepolymeric syrup, component exhibiting an overall solubility parameter between 10 and 11 (A) at least one more ethylenically unsaturated monomers 11.5 less than 10% compounds 11.5, (B) 50% compound 9.5 10-30% 12.5 provided that in case comprises 3-15% polymers 10-12.5; (ii) 20 70% epoxy resins and/or monomers; (iii) effective amount photoinitiator; (iv) nucleophilic latent hardeners for epoxy-containing which are selected provide onset temperature curing reaction 40-100° C. when subjecting adhesive DSC scan rate 20° C./min. furthermore adhesives obtainable photopolymerization thermoset thermal adhesives. is particularly useful bonding plastic substrate other substrates such as metal, glass, ceramic, wood plastics.